Huawei is preparing to bring the Tau Scaling Law and LogicFolding approach to the phone side with the new Kirin processor in the Mate 90 series. Allegedly the chip, 238 million transistors/mm² It will increase the density and aim for a performance close to 3 nm class rival processors. This development means a new path in flagship phones for Huawei, which cannot access EUV lithography machines.
Huawei’s official statement indicates that the Tau Scaling approach focuses on shortening the data path rather than shrinking transistors. LogicFolding, on the other hand, positions chip components on top of each other instead of spreading them out on a plane. In this way, the company aims to reduce signal delay and increase energy efficiency.
Huawei, which showed the return of Kirin 9000S and 5G in 2023 with the Mate 60 Pro, now wants to raise the bar higher with the Mate 90. For New Kirin 53.5 percent higher transistor density, 41 percent performance and core efficiency increaseMoreover 12.7 percent higher peak frequency knowledge stands out.
Emphasis on equivalence is important
Long story short, Huawei does not promise a real 3 nm production process here. The company aims to create a 3 nm class impact with its architecture and stacking design. Therefore, the Mate 90 will not just be a new phone, but the first major consumer test of Huawei’s chip strategy developed under sanctions.
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