Samsung is the first mobile processor developed by 3nm production process Exynos 2500officially announced. This new chip, which has been on the agenda for a long time, has significant differences from the company’s previous generation processors, especially in terms of technical details. With its 10 -core structure, advanced graphic unit and artificial intelligence calculation capabilities, the processor will be used on high -level smartphones that will be released in the second half of 2025.
The new Exynos processor was produced by Samsung’s 3nm GAA (Gate-All-Around) process in Samsung’s own factories. This production technique provides significant advantages compared to the previously used Finfet architecture in terms of energy efficiency and performance balance. It also contributes to less heating and better thermal management for fine devices. In this context, the chip first Galaxy Z Flip 7 It is expected to be released with its model.
The CPU component of the processor consists of 10 cores in total. One of these nuclei has a Cortex-X5 at a speed of 3.3GHz, Cortex-A725 at a speed of 2.74GHz, five at 2.36GHz Cortex-A725 and the remaining Cortex-A520 architecture. This structure aims to provide an efficient performance distribution according to different usage scenarios. This can provide architectural benefit, especially in cases that require high processing power such as multiple tasks and games.
Exynos 2500 offers hardware beam tracking support with RDNA 3 graphic architecture
Samsung’s new generation GPU unit XClipse 950Was built on AMD’s RDNA 3 architecture. This graphic processor can support 120Hz renewal rate at 4K and WQUXGA resolution. It also allows more realistic gaming and application experiences visually, thanks to the rail tracing feature at the hardware level. Since this feature is a technology that can be used limited to date on mobile devices, the Exynos 2500 offers a significant step on the graphic side.
The chip was equipped with 24K Mac NPU specially designed for advanced artificial intelligence calculations. With 2 GNPUs and 2 SNPUs, this unit works by 39 %faster than the previous generation Exynos 2400. This increase allows operations such as visual recognition, language processing or camera optimization within the device to be completed in a shorter time and with less energy. In addition, the integrated digital signal processor (DSP) also works with NPU to support overall performance.
On the camera side, the Exynos 2500 offers highly ambitious hardware support. It supports the configurations of 64MP + 32MP in single -camera systems up to 320MP and dual -camera systems. Zero Shutter Lag) can be offered with these sensors. In addition, 8K resolution 30FPS or 4K resolution 120FPS video records can be recorded. The HDR10-bit-supported registration possibility is also a remarkable feature for users who produce content.
In terms of storage and memory support, the Exynos 2500, which is compatible with LPDDR5X RAM and UFS 4.0 storage units, also appeals to senior devices. These technologies provide higher data transfer speeds and lower power consumption. This creates an advantage especially in terms of long usage times on devices with foldable form factor. In addition, the production of the chip with the FowLP (Fan-Out Wafer-Level Packaging) structure makes an important contribution to thermal and space efficiency.
Between Connection Features Exynos 5400 5G modem stands out. This modem can reach 12.1GBPS at MMWave frequencies and 9.64GBPPs at the sub-6GHz frequencies. In addition, it allows search and messaging in emergencies where the cellular signal cannot be accessed by directly connecting with the satellites in the low Earth (Leo). This feature may have a sense of safety, especially for traveling users.
In terms of connection, the processor supports modern standards such as Wi-Fi 7, Bluetooth 5.4, NFC, USB 3.2 Type-C and GNSS. In this context, high performance can be achieved in both data transfer and interaction between devices. These technical features show that Exynos 2500 offers a comprehensive platform not only in terms of processing power, but also in terms of general device experience.
Samsung is expected to use this new chip with the Galaxy Z Flip 7. Considering the ultra thin body structure of this model, the energy efficiency and thermal advantages of the 3nm production process become even more important. Qualcomm’s high -level chips can be one of the reasons for Samsung’s preferred processor to produce high heat on such devices.
Together with the Exynos 2500, Samsung has once again introduced its own processor developing competence with current technologies. In particular, in terms of production process, graphic architecture and artificial intelligence calculation capabilities, it can be said that this chip can be preferred more frequently in the flagship models of the company. Which models will be included in the Exynos 2500 will be clear in the coming months.