Xiaomi will introduce in September Xiaomi 18 Foldshowed off its design in a big way with its first real-life photos. Sources show the dark red phone with a wide body and a horizontal camera module covering the back. Moreover, Xiaomi has developed its own foldable model. 3 nm XRING O3 processor He has already confirmed that he will use it. Thus, while the photos show the external appearance of the phone, the official processor information already explains the most important detail on the hardware side.
In the resulting images, Xiaomi 18 Fold uses a wider body with different proportions than the company’s previous foldable phones. However, there is a horizontal camera module on the back that extends across the width of the phone. In this section three rear cameras and LED flash, but Xiaomi has not yet announced the specifications of the sensors. Additionally, the company did not share official details about camera resolutions, lens options and zoom features.
Previously published information on the screen side shows that Xiaomi 18 Fold is approximately 7.5 or 7.6 inch internal display He claims he can carry it. However, Xiaomi has not yet officially confirmed the screen size, resolution and refresh rate. The photos clearly show that the aspect ratio of the phone differs from previous Xiaomi foldable models. In addition, the dark red color option largely matches the foldable phone that Lei Jun was holding in his hand before.
XRING O3 determines the hardware of Xiaomi 18 Fold
The most important hardware detail of Xiaomi 18 Fold was developed by the company itself. XRING O3 Mobile Platform It creates. Xiaomi uses TSMC’s technology in the chip it introduced on August 24. 3 nm manufacturing process and uses a 10-core Central Processing Unit. Additionally, the processor has 16 cores on the graphics side. G2-Ultra NX Graphics Processing Unit He works with. According to information provided by Reuters, Xiaomi has invested more than 20 billion yuan in processor studies within the company so far.
In addition, Reuters reported that Xiaomi’s semiconductor team More than 3,000 employees He states that he has reached. XRING O3 thus represents Xiaomi’s second major mobile processor move, developed as an alternative to Qualcomm and MediaTek processors. The company had previously started using its own high-end chip with the XRING O1. Now Xiaomi is launching the XRING O3 in both foldable phones and Xiaomi Pad 9 Pro Max Preparing to use it on your tablet.
In performance figures Xiaomi for XRING O3 5,228,014 points in AnTuTu V11 test explained. Additionally, the company compared the multi-core performance of its 10-core Central Processing Unit to the XRING O1. increased by 60 percent states. The G2-Ultra NX Graphics Processing Unit delivers peak performance compared to the previous generation. increases by 85 percent. According to the data announced by Xiaomi, the graphics unit is also energy efficient. 64 percent increase provides.
On the memory side, XRING O3, LPDDR6 with the support 113.8 GB/s bandwidth offers. In addition, Xiaomi is planning to use NPU dedicated to artificial intelligence processing. 200 TOPS of computing power explains. The company states that it developed this unit especially for artificial intelligence operations carried out on its own MiMo models. AnTuTu score and performance rates come from the test results announced by Xiaomi, independent device tests have not been published yet.
Xiaomi, Xiaomi will launch 18 Fold in China in September previously confirmed. On the other hand, the company has not yet shared official information about the global sales date, price, battery capacity and camera sensors. Xiaomi Pad 9 Pro Max will also be among the products using the XRING O3 processor. The remaining technical features and sales details of the phone will be clarified at Xiaomi’s official launch in September.
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