Danish Kapoor
Danish Kapoor

Qualcomm Snapdragon X80 5G mobile modem and FastConnect 7900 connection system introduced

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Qualcomm introduced its newest flagship mobile modem called Snapdragon X80 5G. X80 5G aims to pair extremely fast 5G speeds with artificial intelligence and expand satellite connectivity support. X80 5G will be used in smartphones, extended reality (XR) devices, computers, vehicles and industrial IoT devices. It is also among the points highlighted by Qualcomm that this modem has a special artificial intelligence processor.

Qualcomm’s latest flagship Snapdragon modem features a custom 5G AI processor with tensor accelerator that promises improved data speeds, coverage, and power efficiency while reducing latency. Built-in 5G AI Suite Gen 3 delivers AI improvements to help with coverage and location accuracy. Qualcomm states that when connected to a mmWave network, 10 percent less power consumption and 30 percent better location accuracy is achieved.

Snapdragon X80 is the first 5G modem to be fully integrated with satellite communications support from narrowband (NB) to non-terrestrial networks (NTN). This means that we are likely to encounter more flagship smartphones that support satellite connectivity later in the year.

Peak download speeds are rated at 10 Gbps, while uploads should theoretically reach 3.5 Gbps with support for both 5G mmWave (10 carrier aggregation) and sub-6 GHz (5 carrier aggregation) frequencies. X80 also brings with it 6 receiver antenna architecture and stands out as the first 5G modem with 6x downlink carrier aggregation and artificial intelligence-based mmWave range extension feature. The X80 uses the same QTM565 mmWave antenna as the Snapdragon X75 modem.

The first devices carrying the Qualcomm Snapdragon X80 5G modem are expected to appear before users in the second half of 2024.

Qualcomm also announced FastConnect 7900 along with Snapdragon X80 5G

Qualcomm also announced the FastConnect 7900 mobile connectivity system, the first system to combine Wi-Fi, Bluetooth and Ultra Wideband connectivity on a single 6nm chip. It supports the latest Wi-Fi 7 standard with peak speeds of up to 5.8 Gbps, as well as Bluetooth 5.4 standard with spatial audio and ANT+ support.

The module also leverages AI enhancements that deliver optimized latency and power consumption while adapting to specific use cases and environments. Qualcomm claims up to 40 percent lower power usage than the previous FastConnect 7800 module.

Qualcomm also touts proximity awareness capabilities with Wi-Fi range and Bluetooth channel audio. FastConnect 7900 supports Extended Personal Area Network Technology (XPAN) and Snapdragon Seamless to connect multiple devices running various operating systems with intelligent voice switching and proximity discovery of devices.

The Wi-Fi chip supports the High Band Synchronous (HBS) standard for instant connection between devices and accessories with low latency. Qualcomm FastConnect 7900 is expected to be commercially available in the second half of 2024.

Danish Kapoor