TSMC plans sub-1nm chip trial in 2029, Apple could be first in line

TSMC, Sub-1nm chip It changed its production calendar to 2029, and this step was directly responded to by Apple. According to new information provided by DigiTimes, the company Test production in 2029 aims to start. Thus settled today 2nm Immediately after the generation, an even more advanced production step comes to the fore. The close cooperation between Apple and TSMC also strengthens the possibility of early access in this context.

However, TSMC does not plan to reach this threshold in one fell swoop. Company, 2 nm volume production started at the end of last year and then set about preparing the next step. On the next step of the roadmap 1.4nm is available. TSMC, this process 2028 aims to put it into operation.

On the other hand, the 1.4 nm process does not only bring size reduction. According to the information provided by the company, this production technique 15 percent higher performance And 30 percent better power efficiency will present. These two data are of direct importance, especially in mobile processors and laptops. Because manufacturers want to combine higher processing power with lower energy consumption.

In addition, preparations for the sub-1 nm step have already begun. According to the news, TSMC in Tainan A10 plant with P1, P2, P3 and P4 is preparing its lines for this transition. Company, 5,000 wafers per month in 2029 trial phase determined production as the first target. This figure marks the first production pace that will show how the process will take shape before commercial expansion.

Apple stands out again in this race

On Apple’s side, the picture extends directly to products. TSMC gave chips with denser transistor layouts to Apple first, a pattern common in previous production transitions. For this reason iPhone and Mac models from the early 2030s Sub-1 nm class processors are already being talked about. Higher transistor density also offers the opportunity to advance processing power and energy efficiency in the same package.

In fact, the main topic here is not just about producing smaller chips. The load on the software side is increasing, on-device artificial intelligence processes are growing and more resources are demanded from processors. Therefore, while new production processes increase performance, battery life It also plays a critical role in protecting This balance, especially on the phone and laptop side, directly affects the daily use of the product.

However, there are several important obstacles to this line. Yield rateTSMC 2nm It stands out as one of the closely watched titles even during the process. The cost of production also remains high, which is why the most advanced SoCs are in the early stages. ultra class It is expected to be reserved for flagships. It is also possible that high-end device prices will move in the opposite direction as chips become smaller.