Huawei’s Ultra Slim Smack Phone with Esim Supported He went to the test stage. Your device, With the new Kirin chip come together and 2 TB Storage Area It is claimed to offer. This model is among the new generation products that the company plans to introduce in 2025. Although not yet confirmed, the device iPhone Air is suggested to compete directly with. Huawei’s, with this device Using physical SIM card It is thought to quit completely.
This new model tested by Huawei With Skytone Go Esim Infrastructure It is estimated to work in harmony. The infrastructure allows users to add operator profiles directly to the phone. This feature can provide a more flexible experience in the network exchange, especially travelers. Company Skytone Go service It is currently tested with a limited group of users, and general use In the third quarter of 2025 It is reported that it is planned to be opened. This information reveals Huawei’s determination to improve connection solutions within its ecosystem.
On the technical side, Kirin 9030 chipset set It is claimed that it will be used on this phone. It is stated that the new chip was developed through the 7 nanometer production process and provides significant improvements in energy efficiency compared to previous generations. However, the processor also has a significant increase in graphic performance. Huawei is trying to increase the capacity of domestic production chips with its recent restructuring process in Hisilicon unit. This new Kirin chipset, both Mate 80 Series It can also be used as a basic platform for this ultra thin model.
Huawei takes a different step in connection technologies with its new model
In terms of design, the device With its thickness below 5.5 millimeters It is suggested that it may come to the fore. This ratio points to a very thin structure compared to today’s flagship phones. Huawei’s examination of the device does not affect the battery capacity Silicon -based battery technology tested. Thus, battery systems that take up less space but provide high energy density can be used. This can make long usage times possible. Your product is only With the support of my wife The information that it will work and will not include a physical SIM slot is repeated in many sources.
Huawei’s developments in the field of hardware seems to affect the production process of this model. The company has made new agreements with the component providers in the supply chain, so that Light metal frame and high strength screen materials is working on. These materials aim to make the device strengthen with delicacy. It is also stated that the device can be released with different storage options and the 2 TB version will be positioned as “high -level model ..