Huawei brings the 1.4 nm target forward with the Tao Law

Huawei is at the point where Moore’s Law is challenged in the semiconductor industry Tao Law He explained the new approach he called. The company participated in the IEEE conference in Shanghai. ISCAS 2026 He announced this plan through He Tingbo at the event. According to the statement, Huawei until 2031 Transistor density equivalent to 1.4nm manufacturing process aims. This goal makes both technical and commercial sense for Huawei, especially due to limitations in access to advanced lithography tools.

Moore’s Law has provided chip makers with a clear path for decades. Manufacturers have shrunk transistors, packed more components into the same space, and increased performance in products from phones to laptops. However, as production costs increased and physical limits became more evident, it became more difficult to progress at the same pace. For this reason, Huawei focuses on the signals traveling within the chip in a shorter time, instead of geometric shrinkage.

The company describes this idea as “time shrinkage.” In this approach, the goal is not only to make the transistor smaller, but also to shorten the signal path within the chip and reduce delay. The time it takes for data to travel from one point to another in a processor has a direct impact on performance and power consumption. Therefore, Huawei aims to achieve efficiency gains without switching to a smaller production process.

At the center of this plan LogicFolding There is an architecture called . Huawei positions this method as reorganizing a long path with shorter connections. More efficient placement of logic blocks can allow the signal to travel shorter distances within the chip. In addition, the company states that this approach works together at the device, circuit, chip and full system level.

LogicFolding takes first commercial step on Huawei’s Kirin chips

Huawei released one of the first major commercial products using LogicFolding 2026 Kirin mobile chip plans to launch it on the market. The company expects this chip to be introduced in the fall. This step on the Kirin side shows that Huawei focuses not only on the production process but also on architectural arrangement in its mobile processor development line. Increased performance and energy efficiency are also among the main expectations of the company for this chip.

According to the information shared by He Tingbo, Huawei has been using ideas related to this approach in the last six years. Designed the 381 chip and brought it to mass production. This number shows that the company does not want to leave the Law of Tao as just a theoretical presentation. However, Huawei has not shared independent test results, comparative performance tables or consumption measurements at this stage. For this reason, 2026 Kirin chips will be among the first concrete examples that will show how the claim will be reflected in the commercial product.

Huawei’s 1.4nm equivalent density Its target should also be read in the correct context. The company does not say that it will produce a real 1.4 nm chip using traditional methods. Instead, it aims to approach similar computing capacity with smarter chip architecture, shorter signal path, and system-level optimization. The fact that manufacturers such as TSMC point to a period after 2028 for 1.4 nm class processes places Huawei’s statement at a different point than the direct production node.

Huawei also emphasized cooperation at the event. He Tingbo said that no single company can solve the problems in the semiconductor industry alone. This message covers a wide range of areas, from production equipment to design tools, from chip architecture to system software. Therefore, Tao’s Law is not just Kirin chip news, but stands out as the name of Huawei’s quest to continue its semiconductor progress through different technical means.